SOLDERING AND RELIABILITY. INTERNATIONAL CONFERENCE. 2008. (IN CONJUNCTION WITH SMTA LEAD-FREE ACADEMY AND TABLETOP EXHIBITION)

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004036
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Details

  • Title: International Conference on Soldering and Reliability 2008
  • Subtitle: In Conjunction with SMTA Lead-free Academy and Tabletop Exhibition
  • Date/Location: Held 14-16 May 2008, Toronto, Ontario, Canada.
  • ISBN: 9781605606156
  • Pages: 238 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Feb 2009 )

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  • Title: International Conference on Soldering and Reliability 2008
  • Subtitle: In Conjunction with SMTA Lead-free Academy and Tabletop Exhibition
  • Date/Location: Held 14-16 May 2008, Toronto, Ontario, Canada.
  • ISBN: 9781605606156
  • Pages: 238 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Feb 2009 )