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SOLDERING AND RELIABILITY. INTERNATIONAL CONFERENCE. 2008. (IN CONJUNCTION WITH SMTA LEAD-FREE ACADEMY AND TABLETOP EXHIBITION)
- Item #:
- 004036
- UPC:
Details
-
Title:
International Conference on Soldering and Reliability 2008
-
Subtitle:
In Conjunction with SMTA Lead-free Academy and Tabletop Exhibition
-
Date/Location:
Held 14-16 May 2008, Toronto, Ontario, Canada.
-
ISBN:
9781605606156
-
Pages:
238 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Surface Mount Technology Association (SMTA)
-
POD Publisher:
Curran Associates, Inc. ( Feb 2009 )
-
Title:
International Conference on Soldering and Reliability 2008
-
Subtitle:
In Conjunction with SMTA Lead-free Academy and Tabletop Exhibition
-
Date/Location:
Held 14-16 May 2008, Toronto, Ontario, Canada.
-
ISBN:
9781605606156
-
Pages:
238 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Surface Mount Technology Association (SMTA)
-
POD Publisher:
Curran Associates, Inc. ( Feb 2009 )