ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 11TH 2010. (ICEPT-HDP 2010) (CD-ROM)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 11TH 2010. (ICEPT-HDP 2010) (CD-ROM)

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009423
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Details

  • Title: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010)
  • Date/Location: Held 16-19 August 2010, Xi'an, China.
  • IEEE #: CFP10553-CDR
  • ISBN: 9781424481415
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2010 )

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  • Title: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010)
  • Date/Location: Held 16-19 August 2010, Xi'an, China.
  • IEEE #: CFP10553-CDR
  • ISBN: 9781424481415
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2010 )