Details
- Title: Semiconductor Packaging Roadmaps: Applications Driving Requirements
- Date/Location: Held 10 November 2010, Santa Clara, California, USA.
- ISBN: 9781617821868
- Pages: 248 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Apr 2011 )
Description
Members/Attendees
Tab 4
- Title: Semiconductor Packaging Roadmaps: Applications Driving Requirements
- Date/Location: Held 10 November 2010, Santa Clara, California, USA.
- ISBN: 9781617821868
- Pages: 248 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Apr 2011 )