Details
- Title: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT 2010)
- Date/Location: Held 20-22 October 2010, Taipei, Taiwan.
- IEEE #: CFP1059B-POD
- ISBN: 9781424497836
- Pages: 1,154 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2011 )
Description
Members/Attendees
Tab 4
- Title: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT 2010)
- Date/Location: Held 20-22 October 2010, Taipei, Taiwan.
- IEEE #: CFP1059B-POD
- ISBN: 9781424497836
- Pages: 1,154 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2011 )