Details
- Title: 2011 IEEE International Symposium on VR Innovation (ISVRI 2011)
- Date/Location: Held 19-20 March 2011, Singapore.
- Editor: Pank, J.
- IEEE #: CFP11ISV-POD
- ISBN: 9781457700552
- Pages: 354 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2011 )
Description
Members/Attendees
Tab 4
- Title: 2011 IEEE International Symposium on VR Innovation (ISVRI 2011)
- Date/Location: Held 19-20 March 2011, Singapore.
- Editor: Pank, J.
- IEEE #: CFP11ISV-POD
- ISBN: 9781457700552
- Pages: 354 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2011 )