MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 6TH 2011. (IMPACT 2011) (USB)

MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 6TH 2011. (IMPACT 2011) (USB)

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013781
$130.50 - $261.00
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Details

  • Title: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2011)
  • Date/Location: Held 19-21 October 2011, Taipei, Taiwan.
  • IEEE #: CFP1159B-USB
  • ISBN: 9781457713880
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2012 )

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Tab 4

 
  • Title: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2011)
  • Date/Location: Held 19-21 October 2011, Taipei, Taiwan.
  • IEEE #: CFP1159B-USB
  • ISBN: 9781457713880
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2012 )