Details
- Title: KNOWN GOOD DIE: In an Era of Multi-Die Packaging and 3D Integration 2011
- Date/Location: Held 10 November 2011, Santa Clara, California, USA.
- ISBN: 9781618394491
- Pages: 201 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Mar 2012 )
Description
Members/Attendees
Tab 4
- Title: KNOWN GOOD DIE: In an Era of Multi-Die Packaging and 3D Integration 2011
- Date/Location: Held 10 November 2011, Santa Clara, California, USA.
- ISBN: 9781618394491
- Pages: 201 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Mar 2012 )