UNDERFILL CHALLENGES FOR 3D INTERCONNECT. 2012.

UNDERFILL CHALLENGES FOR 3D INTERCONNECT. 2012.

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017159
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Details

  • Title: Underfill Challenges for 3D Interconnect 2012
  • Date/Location: Held 9 November 2012, San Jose, California, USA.
  • ISBN: 9781622768349
  • Pages: 123 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Apr 2013 )

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  • Title: Underfill Challenges for 3D Interconnect 2012
  • Date/Location: Held 9 November 2012, San Jose, California, USA.
  • ISBN: 9781622768349
  • Pages: 123 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Apr 2013 )