ROADMAPS FOR MULTI DIE INTEGRATION. 2012. (CO-LOCATED WITH KNOWN GOOD DIE 2012) STRATEGIES AND DRIVERS

ROADMAPS FOR MULTI DIE INTEGRATION. 2012. (CO-LOCATED WITH KNOWN GOOD DIE 2012) STRATEGIES AND DRIVERS

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017473
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  • Title: Roadmaps for Multi Die Integration
  • Subtitle: Strategies and Drivers (Co-located with Known Good Die 2012)
  • Date/Location: Held 14 November 2012, Santa Clara, California, USA.
  • Series: MEPTEC Symposium Proceedings Number 51
  • ISBN: 9781622769605
  • Pages: 117 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
  • POD Publisher: Curran Associates, Inc. ( May 2013 )

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  • Title: Roadmaps for Multi Die Integration
  • Subtitle: Strategies and Drivers (Co-located with Known Good Die 2012)
  • Date/Location: Held 14 November 2012, Santa Clara, California, USA.
  • Series: MEPTEC Symposium Proceedings Number 51
  • ISBN: 9781622769605
  • Pages: 117 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
  • POD Publisher: Curran Associates, Inc. ( May 2013 )