Details
- Title: 2013 European Microelectronics Packaging Conference (EMPC 2013)
- Date/Location: Held 9-12 September 2013, Grenoble, France.
- IEEE #: CFP1354H-POD
- ISBN: 9782952746717
- Pages: 586 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2014 )
Description
Members/Attendees
Tab 4
- Title: 2013 European Microelectronics Packaging Conference (EMPC 2013)
- Date/Location: Held 9-12 September 2013, Grenoble, France.
- IEEE #: CFP1354H-POD
- ISBN: 9782952746717
- Pages: 586 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2014 )