THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 2014. (ITHERM 2014) (USB)

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023424
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  • Title: 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2014)
  • Date/Location: Held 27-30 May 2014, Orlando, Florida, USA.
  • IEEE #: CFP14ITH-USB
  • ISBN: 9781479952663
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2014 )

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Tab 4

 
  • Title: 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2014)
  • Date/Location: Held 27-30 May 2014, Orlando, Florida, USA.
  • IEEE #: CFP14ITH-USB
  • ISBN: 9781479952663
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2014 )