THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 16TH 2015. (EuroSimE 2015) (CD-ROM)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 16TH 2015. (EuroSimE 2015) (CD-ROM)

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026209
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  • Title: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015)
  • Date/Location: Held 19-22 April 2015, Budapest, Hungary.
  • IEEE #: CFP15566-CDR
  • ISBN: 9781479999491
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2015 )

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  • Title: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015)
  • Date/Location: Held 19-22 April 2015, Budapest, Hungary.
  • IEEE #: CFP15566-CDR
  • ISBN: 9781479999491
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2015 )