ELECTROMAGNETIC COMPATIBILITY AND SIGNAL INTEGRITY. IEEE SYMPOSIUM. 2015. (EMC&SI 2015)

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026215
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  • Title: 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (EMC&SI 2015)
  • Date/Location: Held 15-21 March 2015, Santa Clara, California, USA.
  • IEEE #: CFP1568X-POD
  • ISBN: 9781479919949
  • Pages: 369 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2015 )

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  • Title: 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (EMC&SI 2015)
  • Date/Location: Held 15-21 March 2015, Santa Clara, California, USA.
  • IEEE #: CFP1568X-POD
  • ISBN: 9781479919949
  • Pages: 369 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2015 )