Details
- Title: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC 2015)
- Date/Location: Held 14-17 April 2015, Kyoto, Japan.
- IEEE #: CFP1589U-POD
- ISBN: 9781479919536
- Pages: 893 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2015 )
Description
Members/Attendees
Tab 4
- Title: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC 2015)
- Date/Location: Held 14-17 April 2015, Kyoto, Japan.
- IEEE #: CFP1589U-POD
- ISBN: 9781479919536
- Pages: 893 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2015 )