Details
- Title: 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2015)
- Date/Location: Held 29 June - 2 July 2015, Hsinchu, Taiwan.
- IEEE #: CFP15777-POD
- ISBN: 9781479999293
- Pages: 580 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2015 )
Description
Members/Attendees
Tab 4
- Title: 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2015)
- Date/Location: Held 29 June - 2 July 2015, Hsinchu, Taiwan.
- IEEE #: CFP15777-POD
- ISBN: 9781479999293
- Pages: 580 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2015 )