Details
- Title: 2015 European Microelectronics Packaging Conference (EMPC 2015)
- Date/Location: Held 14-16 September 2015, Friedrichshafen, Germany.
- IEEE #: CFP1554H-POD
- ISBN: 9781509001989
- Pages: 527 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2016 )
Description
Members/Attendees
Tab 4
- Title: 2015 European Microelectronics Packaging Conference (EMPC 2015)
- Date/Location: Held 14-16 September 2015, Friedrichshafen, Germany.
- IEEE #: CFP1554H-POD
- ISBN: 9781509001989
- Pages: 527 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2016 )