Details
- Title: 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2015)
- Date/Location: Held 14-16 December 2015, Seoul, South Korea.
- IEEE #: CFP15EDP-POD
- ISBN: 9781467381000
- Pages: 228 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2016 )
Description
Members/Attendees
Tab 4
- Title: 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2015)
- Date/Location: Held 14-16 December 2015, Seoul, South Korea.
- IEEE #: CFP15EDP-POD
- ISBN: 9781467381000
- Pages: 228 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2016 )