Details
- Title: 2007 IEEE Hot Chips 19 Symposium (HCS 2007)
- Date/Location: Held 19-21 August 2007, Stanford, California, USA.
- IEEE #: CFP07HCS-POD
- ISBN: 9781467388702
- Pages: 396 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2016 )
Description
Members/Attendees
Tab 4
- Title: 2007 IEEE Hot Chips 19 Symposium (HCS 2007)
- Date/Location: Held 19-21 August 2007, Stanford, California, USA.
- IEEE #: CFP07HCS-POD
- ISBN: 9781467388702
- Pages: 396 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2016 )