Details
- Title: 2015 IEEE Hot Chips 27 Symposium (HCS 2015)
- Date/Location: Held 22-25 August 2015, Cupertino, California, USA.
- IEEE #: CFP15HCS-POD
- ISBN: 9781467388863
- Pages: 534 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2016 )
Description
Members/Attendees
Tab 4
- Title: 2015 IEEE Hot Chips 27 Symposium (HCS 2015)
- Date/Location: Held 22-25 August 2015, Cupertino, California, USA.
- IEEE #: CFP15HCS-POD
- ISBN: 9781467388863
- Pages: 534 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2016 )