THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 17TH 2016. (EuroSimE 2016) (USB)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 17TH 2016. (EuroSimE 2016) (USB)

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030307
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  • Title: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016)
  • Date/Location: Held 18-20 April 2016, Montpellier, France.
  • IEEE #: CFP16566-USB
  • ISBN: 9781509021208
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2016 )

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  • Title: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016)
  • Date/Location: Held 18-20 April 2016, Montpellier, France.
  • IEEE #: CFP16566-USB
  • ISBN: 9781509021208
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2016 )