PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE AND ELECTRONICS PACKAGING 7. (AT THE 228TH ECS MEETING)

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030394
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  • Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
  • Date/Location: Held 11-15 October 2015, Phoenix, Arizona, USA.
  • Series: ECS Transactions Volume 69 No.06
  • Editor: Kondo, K et al.
  • ISBN: 9781623323134
  • Pages: 111 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jun 2016 )

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  • Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
  • Date/Location: Held 11-15 October 2015, Phoenix, Arizona, USA.
  • Series: ECS Transactions Volume 69 No.06
  • Editor: Kondo, K et al.
  • ISBN: 9781623323134
  • Pages: 111 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jun 2016 )