Details
- Title: 2016 International Conference on Electronics Packaging (ICEP 2016)
- Date/Location: Held 20-22 April 2016, Hokkaido, Japan.
- IEEE #: CFP1689U-CDR
- ISBN: 9784904090169
- Format: CD-ROM
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2016 )
Description
Members/Attendees
Tab 4
- Title: 2016 International Conference on Electronics Packaging (ICEP 2016)
- Date/Location: Held 20-22 April 2016, Hokkaido, Japan.
- IEEE #: CFP1689U-CDR
- ISBN: 9784904090169
- Format: CD-ROM
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2016 )