THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 15TH 2016. (ITherm 2016) (2 VOLS)

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031032
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Details

  • Title: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2016)
  • Date/Location: Held 31 May - 3 June 2016, Las Vegas, Nevada, USA.
  • IEEE #: CFP16ITH-POD
  • ISBN: 9781467381222
  • Pages: 1,581 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2016 )

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  • Title: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2016)
  • Date/Location: Held 31 May - 3 June 2016, Las Vegas, Nevada, USA.
  • IEEE #: CFP16ITH-POD
  • ISBN: 9781467381222
  • Pages: 1,581 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2016 )