PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS. IEEE INTERNATIONAL SYMPOSIUM. 23RD 2016. (IPFA 2016) (USB)

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031649
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Details

  • Title: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016)
  • Date/Location: Held 18-21 July 2016, Singapore.
  • IEEE #: CFP16777-USB
  • ISBN: 9781467382588
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2016 )

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  • Title: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016)
  • Date/Location: Held 18-21 July 2016, Singapore.
  • IEEE #: CFP16777-USB
  • ISBN: 9781467382588
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2016 )