Details
- Title: 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2016)
- Date/Location: Held 6-8 September 2016, Nuremberg, Germany.
- IEEE #: CFP16SSD-POD
- ISBN: 9781509008193
- Pages: 387 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2016 )
Description
Members/Attendees
Tab 4
- Title: 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2016)
- Date/Location: Held 6-8 September 2016, Nuremberg, Germany.
- IEEE #: CFP16SSD-POD
- ISBN: 9781509008193
- Pages: 387 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2016 )