Details
- Title: 2016 12th International Congress Molded Interconnect Devices (MID 2016)
- Date/Location: Held 28-29 September 2016, Wuerzburg, Germany.
- IEEE #: CFP16J74-POD
- ISBN: 9781509054299
- Pages: 123 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2017 )
Description
Members/Attendees
Tab 4
- Title: 2016 12th International Congress Molded Interconnect Devices (MID 2016)
- Date/Location: Held 28-29 September 2016, Wuerzburg, Germany.
- IEEE #: CFP16J74-POD
- ISBN: 9781509054299
- Pages: 123 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2017 )