ELECTRONICS MANUFACTURING TECHNOLOGY. IEEE INTERNATIONAL CONFERENCE. 37TH 2016. (IEMT 2016) (AND 18TH ELECTRONICS MATERIALS AND PACKAGING CONFERENCE)

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032376
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  • Title: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT 2016) & 18th Electronics Materials and Packaging (EMAP 2016) Conference
  • Date/Location: Held 20-22 September 2016, Georgetown, Penang, Malaysia.
  • IEEE #: CFP16IEU-POD
  • ISBN: 9781509034444
  • Pages: 327 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2017 )

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  • Title: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT 2016) & 18th Electronics Materials and Packaging (EMAP 2016) Conference
  • Date/Location: Held 20-22 September 2016, Georgetown, Penang, Malaysia.
  • IEEE #: CFP16IEU-POD
  • ISBN: 9781509034444
  • Pages: 327 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2017 )