Details
- Title: 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2016)
- Date/Location: Held 14-16 December 2016, Honolulu, Hawaii, USA.
- IEEE #: CFP16EDP-POD
- ISBN: 9781509061860
- Pages: 221 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2017 )
Description
Members/Attendees
Tab 4
- Title: 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2016)
- Date/Location: Held 14-16 December 2016, Honolulu, Hawaii, USA.
- IEEE #: CFP16EDP-POD
- ISBN: 9781509061860
- Pages: 221 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2017 )