Details
- Title: Semiconductor Wafer Bonding: Science, Technology and Applications 14
- Subtitle: PRiME 2016
- Date/Location: Held 2-7 October 2016, Honolulu, Hawaii, USA.
- Series: ECS Transactions Volume 75 No.09
- Editor: Suga, T. et al.
- ISBN: 9781607687269
- Pages: 365 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( May 2017 )
Description
Members/Attendees
Tab 4
- Title: Semiconductor Wafer Bonding: Science, Technology and Applications 14
- Subtitle: PRiME 2016
- Date/Location: Held 2-7 October 2016, Honolulu, Hawaii, USA.
- Series: ECS Transactions Volume 75 No.09
- Editor: Suga, T. et al.
- ISBN: 9781607687269
- Pages: 365 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( May 2017 )