Details
- Title: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2017)
- Date/Location: Held 3-5 April 2017, Dresden, Germany.
- IEEE #: CFP17566-POD
- ISBN: 9781509043453
- Pages: 556 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2017)
- Date/Location: Held 3-5 April 2017, Dresden, Germany.
- IEEE #: CFP17566-POD
- ISBN: 9781509043453
- Pages: 556 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2017 )