Details
- Title: 2017 International Conference on Electronics Packaging (ICEP 2017)
- Date/Location: Held 19-22 April 2017, Yamagata, Japan.
- IEEE #: CFP1789U-POD
- ISBN: 9781509048885
- Pages: 604 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 International Conference on Electronics Packaging (ICEP 2017)
- Date/Location: Held 19-22 April 2017, Yamagata, Japan.
- IEEE #: CFP1789U-POD
- ISBN: 9781509048885
- Pages: 604 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2017 )