Details
- Title: 2017 International Conference on Electronics Packaging (ICEP 2017)
- Date/Location: Held 19-22 April 2017, Yamagata, Japan.
- IEEE #: CFP1789U-USB
- ISBN: 9784990218829
- Format: USB
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 International Conference on Electronics Packaging (ICEP 2017)
- Date/Location: Held 19-22 April 2017, Yamagata, Japan.
- IEEE #: CFP1789U-USB
- ISBN: 9784990218829
- Format: USB
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2017 )