SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 7. (231ST ECS MEETING)

Item #:
034596
$92.80 - $116.00
Adding to cart… The item has been added

Details

  • Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7
  • Subtitle: 231st ECS Meeting
  • Date/Location: Held 28 May - 1 June 2017, New Orleans, Louisiana, USA.
  • Series: ECS Transactions Volume 77 No.05
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781607688082
  • Pages: 269 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jun 2017 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7
  • Subtitle: 231st ECS Meeting
  • Date/Location: Held 28 May - 1 June 2017, New Orleans, Louisiana, USA.
  • Series: ECS Transactions Volume 77 No.05
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781607688082
  • Pages: 269 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jun 2017 )