Details
- Title: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)
- Date/Location: Held 16-18 May 2017, Tokyo, Japan.
- IEEE #: CFP1718S-POD
- ISBN: 9781538615980
- Pages: 86 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)
- Date/Location: Held 16-18 May 2017, Tokyo, Japan.
- IEEE #: CFP1718S-POD
- ISBN: 9781538615980
- Pages: 86 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2017 )