Details
- Title: 2017 IEEE/ACM 1st International Workshop on Design and Innovation in Software Engineering (DISE 2017)
- Date/Location: Held 23 May 2017, Buenos Aires, Argentina.
- IEEE #: CFP17L85-POD
- ISBN: 9781538604014
- Pages: 17 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 IEEE/ACM 1st International Workshop on Design and Innovation in Software Engineering (DISE 2017)
- Date/Location: Held 23 May 2017, Buenos Aires, Argentina.
- IEEE #: CFP17L85-POD
- ISBN: 9781538604014
- Pages: 17 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )