Details
- Title: 2017 IEEE/ACM 3rd International Workshop on Software Engineering for Smart Cyber-Physical Systems (SEsCPS 2017)
- Date/Location: Held 21 May 2017, Buenos Aires, Argentina.
- IEEE #: CFP17C63-POD
- ISBN: 9781538640449
- Pages: 41 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 IEEE/ACM 3rd International Workshop on Software Engineering for Smart Cyber-Physical Systems (SEsCPS 2017)
- Date/Location: Held 21 May 2017, Buenos Aires, Argentina.
- IEEE #: CFP17C63-POD
- ISBN: 9781538640449
- Pages: 41 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )