Details
- Title: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2017)
- Date/Location: Held 29 May - 1 June 2017, Bordeaux, France.
- IEEE #: CFP17DTI-POD
- ISBN: 9781538629536
- Pages: 264 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2017)
- Date/Location: Held 29 May - 1 June 2017, Bordeaux, France.
- IEEE #: CFP17DTI-POD
- ISBN: 9781538629536
- Pages: 264 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )