Details
- Title: 2017 IEEE Technology & Engineering Management Conference (TEMSCON 2017)
- Date/Location: Held 8-10 June 2017, Santa Clara, California, USA.
- IEEE #: CFP17G19-POD
- ISBN: 9781509011155
- Pages: 459 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 IEEE Technology & Engineering Management Conference (TEMSCON 2017)
- Date/Location: Held 8-10 June 2017, Santa Clara, California, USA.
- IEEE #: CFP17G19-POD
- ISBN: 9781509011155
- Pages: 459 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )