Details
- Title: 2017 18th International Conference on Electronic Packaging Technology (ICEPT 2017)
- Date/Location: Held 16-19 August 2017, Harbin, China.
- IEEE #: CFP17553-POD
- ISBN: 9781538629734
- Pages: 1,707 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 18th International Conference on Electronic Packaging Technology (ICEPT 2017)
- Date/Location: Held 16-19 August 2017, Harbin, China.
- IEEE #: CFP17553-POD
- ISBN: 9781538629734
- Pages: 1,707 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2017 )