ELECTROMAGNETIC COMPATIBILITY AND SIGNAL/POWER INTEGRITY. IEEE INTERNATIONAL SYMPOSIUM. 2017. (EMCSI 2017) (3 VOLS IN 5 PARTS)

ELECTROMAGNETIC COMPATIBILITY AND SIGNAL/POWER INTEGRITY. IEEE INTERNATIONAL SYMPOSIUM. 2017. (EMCSI 2017) (3 VOLS IN 5 PARTS)

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036282
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Details

  • Title: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI 2017)
  • Date/Location: Held 7-11 August 2017, Washington, DC, USA.
  • IEEE #: CFP17EMC-POD
  • ISBN: 9781538622322
  • Pages: 3,077 (5 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2018 )

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Tab 4

 
  • Title: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI 2017)
  • Date/Location: Held 7-11 August 2017, Washington, DC, USA.
  • IEEE #: CFP17EMC-POD
  • ISBN: 9781538622322
  • Pages: 3,077 (5 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2018 )