Details
- Title: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017)
- Date/Location: Held 4-7 July 2017, Chengdu, China.
- IEEE #: CFP17777-POD
- ISBN: 9781538617809
- Pages: 710 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017)
- Date/Location: Held 4-7 July 2017, Chengdu, China.
- IEEE #: CFP17777-POD
- ISBN: 9781538617809
- Pages: 710 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2017 )