PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS. IEEE INTERNATIONAL SYMPOSIUM. 24TH 2017. (IPFA 2017) (USB)

PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS. IEEE INTERNATIONAL SYMPOSIUM. 24TH 2017. (IPFA 2017) (USB)

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036352
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Details

  • Title: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017)
  • Date/Location: Held 4-7 July 2017, Chengdu, China.
  • IEEE #: CFP17777-USB
  • ISBN: 9781538617786
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2017 )

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  • Title: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017)
  • Date/Location: Held 4-7 July 2017, Chengdu, China.
  • IEEE #: CFP17777-USB
  • ISBN: 9781538617786
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2017 )