E-MANUFACTURING AND DESIGN COLLABORATION. JOINT INTERNATIONAL SYMPOSIUM. 2017. (EMDC 2017) (AND INTL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING - ISSM 2017)

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036690

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Details

Title: 2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC 2017) & Semiconductor Manufacturing (ISSM 2017)
Date/Location: Held 15 September 2017, Hsinchu, Taiwan.
IEEE #: CFP17SSM-POD
ISBN: 9781538612163
Pages: 77 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Nov 2017 )

Title: 2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC 2017) & Semiconductor Manufacturing (ISSM 2017)
Date/Location: Held 15 September 2017, Hsinchu, Taiwan.
IEEE #: CFP17SSM-POD
ISBN: 9781538612163
Pages: 77 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Nov 2017 )