Details
- Title: 2017 IEEE 17th International Working Conference on Source Code Analysis and Manipulation (SCAM 2017)
- Date/Location: Held 17-18 September 2017, Shanghai, China.
- IEEE #: CFP17SRC-POD
- ISBN: 9781538632390
- Pages: 165 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 IEEE 17th International Working Conference on Source Code Analysis and Manipulation (SCAM 2017)
- Date/Location: Held 17-18 September 2017, Shanghai, China.
- IEEE #: CFP17SRC-POD
- ISBN: 9781538632390
- Pages: 165 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2017 )