Details
- Title: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2017)
- Date/Location: Held 25-27 October 2017, Taipei, Taiwan.
- IEEE #: CFP1759B-POD
- ISBN: 9781538647202
- Pages: 339 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )
Description
Members/Attendees
Tab 4
- Title: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2017)
- Date/Location: Held 25-27 October 2017, Taipei, Taiwan.
- IEEE #: CFP1759B-POD
- ISBN: 9781538647202
- Pages: 339 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )