MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 12TH 2017. (IMPACT 2017) (USB)

MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 12TH 2017. (IMPACT 2017) (USB)

Item #:
037333
$117.00 - $234.00
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Details

  • Title: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2017)
  • Date/Location: Held 25-27 October 2017, Taipei, Taiwan.
  • IEEE #: CFP1759B-USB
  • ISBN: 9781538647189
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2018 )

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  • Title: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2017)
  • Date/Location: Held 25-27 October 2017, Taipei, Taiwan.
  • IEEE #: CFP1759B-USB
  • ISBN: 9781538647189
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2018 )