Details
- Title: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2017)
- Date/Location: Held 27-29 September 2017, Amsterdam, Netherlands.
- IEEE #: CFP17TII-POD
- ISBN: 9781538619292
- Pages: 346 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )
Description
Members/Attendees
Tab 4
- Title: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2017)
- Date/Location: Held 27-29 September 2017, Amsterdam, Netherlands.
- IEEE #: CFP17TII-POD
- ISBN: 9781538619292
- Pages: 346 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )