Details
- Title: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing 2017)
- Date/Location: Held 28-31 October 2017, Beijing, China.
- IEEE #: CFP17J66-POD
- ISBN: 9781509051861
- Pages: 652 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )
Description
Members/Attendees
Tab 4
- Title: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing 2017)
- Date/Location: Held 28-31 October 2017, Beijing, China.
- IEEE #: CFP17J66-POD
- ISBN: 9781509051861
- Pages: 652 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )