Details
- Title: 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME 2017)
- Date/Location: Held 26-29 October 2017, Constanta, Romania.
- IEEE #: CFP1707I-POD
- ISBN: 9781538616277
- Pages: 458 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )
Description
Members/Attendees
Tab 4
- Title: 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME 2017)
- Date/Location: Held 26-29 October 2017, Constanta, Romania.
- IEEE #: CFP1707I-POD
- ISBN: 9781538616277
- Pages: 458 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )