DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING. IEEE INTERNATIONAL SYMPOSIUM. 23RD 2017. (SIITME 2017) (USB)

DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING. IEEE INTERNATIONAL SYMPOSIUM. 23RD 2017. (SIITME 2017) (USB)

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037795
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Details

  • Title: 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME 2017)
  • Date/Location: Held 26-29 October 2017, Constanta, Romania.
  • IEEE #: CFP1707I-USB
  • ISBN: 9781538616253
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2018 )

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  • Title: 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME 2017)
  • Date/Location: Held 26-29 October 2017, Constanta, Romania.
  • IEEE #: CFP1707I-USB
  • ISBN: 9781538616253
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2018 )